MPPC S13360-3050VE

S13360-3050VE
Datasheet [424 KB/PDF]

The MPPC employes through-hole electrodes called TSV (through-silicon via). Since no electrode space for wire bonding is needed, the gap (between the package edge and the MPPC photosensitive area) around the outer periphery is reduced to 0.2 mm on the four sides, allowing a four-side buttable arrangement.
The product is optimized for medical imaging and high-energy particle detection requiring photon counting measurement, as well as other applications involving low-light-level detection.

Features
- Reduced crosstalk (compared to previous products)
- COB (chip on board) package with minimal dead space
- Tiling forms a large sensitive area
- Low afterpulse
* Please contact us for more details.

Specifications

Package type Surface mount type
Number of channels 1 ch
Effective photosensitive area / ch 3 × 3 mm
Number of pixels /ch 3584
Pixel size 50 μm
Spectral response range 320 to 900 nm
Peak sensitivity wavelength (typ.) 450 nm
Dark count/ch (typ.) 2000 kcps
Terminal capacitance/ch (typ.) 1300 pF
Gain (typ.) 1.7×106
Measurement condition Ta=25 ℃

Dimensional outline (unit: mm)

KAPDA0175

Related documents

Recommended products

Disclaimer [66 KB/PDF]

Saved items

    The save-to-list function can only work if JavaScript is turned on.

Recently viewed items

    The recently viewed function can only work if JavaScript is turned on.

Scroll to Top